Array microphone module and system

ABSTRACT

A microphone module comprises a housing, an audio bus, and a first plurality of microphones in communication with the audio bus. The microphone module further comprises a module processor in communication with the first plurality of microphones and the audio bus. The module processor is configured to detect the presence of an array processor in communication with the audio bus, detect the presence of a second microphone module in communication with the audio bus, and configure the audio bus to pass audio signals from both the first plurality of microphones and the second microphone module to the array processor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/594,927, filed on Oct. 7, 2019, which is a continuation of U.S.patent application Ser. No. 15/880,151, now U.S. Pat. No. 10,440,469,filed on Jan. 25, 2018, which claims the benefit of U.S. ProvisionalPatent Application No. 62/451,480, filed on Jan. 27, 2017. The contentsof these applications are incorporated herein in their entireties.

TECHNICAL FIELD

This application generally relates to an array microphone module andsystems therefore. In particular, this application relates to an arraymicrophone module that is capable of being connected with other likearray microphone modules to create a configurable system of modulararray microphone modules.

BACKGROUND

Conferencing environments, such as conference rooms, boardrooms, videoconferencing applications, and the like, can involve the use ofmicrophones for capturing sound from various audio sources active insuch environments. Such audio sources may include humans speaking, forexample. The captured sound may be disseminated to a local audience inthe environment through amplified speakers (for sound reinforcement), orto others remote from the environment (such as via a telecast and/or awebcast).

Traditional microphones typically have fixed polar patterns and fewmanually selectable settings. To capture sound in a conferencingenvironment, many traditional microphones are often used at once tocapture the audio sources within the environment. However, traditionalmicrophones tend to capture unwanted audio as well, such as room noise,echoes, and other undesirable audio elements. The capturing of theseunwanted noises is exacerbated by the use of many microphones.

Array microphones provide benefits in that they have steerable coverageor pick up patterns, which allow the microphones to focus on the desiredaudio sources and reject unwanted sounds such as room noise. The abilityto steer audio pick up patterns provides the benefit of being able to beless precise in microphone placement, and in this way, array microphonesare more forgiving. Moreover, array microphones provide the ability topick up multiple audio sources with one array microphone or unit, againdue to the ability to steer the pickup patterns.

However, array microphones have certain shortcomings, including the factthat they are typically relatively larger than traditional microphones,and their fixed size often limits where they can be placed in anenvironment. Moreover, when larger numbers of array microphones areused, the microphone elements of one array microphone do not work inconjunction with the microphone elements of another array microphone.Systems of array microphones can often be difficult to configureproperly. Also, array microphones are usually significantly more costlythan traditional microphones. Given these shortcomings, arraymicrophones are usually custom fit to their application, causing them tobe primarily used in large scale, highly customized, and costlyinstallations.

Accordingly, there is an opportunity for systems that address theseconcerns. More particularly, there is an opportunity for modular systemsincluding an array microphone module that is easily scalable, flexiblein mounting position, and self configuring to allow the system tooptimally detect sounds from an audio source, e.g., a human speaker, andreject unwanted noise and reflections.

SUMMARY

The invention is intended to solve the above-noted problems by providingsystems and methods that are designed to, among other things: (1)provide an array microphone module that is modular and scalable, and canbe connected to other such modules to create array microphone systems ofeasily customized shapes and sizes; and (2) provide an array microphonesystem comprising an array processor connected to a plurality of sucharray microphone modules to achieve a self-configuring array microphonesystem with improved directional sensitivity.

In an embodiment, a microphone module comprises a housing, an audio bus,and a first plurality of microphones supported by the housing. Each ofthe first plurality of microphones is in communication with the audiobus. The microphone module further comprises a module processor incommunication with the first plurality of microphones and the audio bus.The module processor is configured to detect the presence of an arrayprocessor in communication with the audio bus, detect the presence of asecond microphone module in communication with the audio bus, andconfigure the audio bus to pass audio signals from both the firstplurality of microphones and the second microphone module to the arrayprocessor.

In another embodiment, a modular array microphone system comprises anarray processor and a microphone module. The microphone module comprisesa housing, an audio bus in communication with the array processor, and aplurality of microphones supported by the housing, each of the pluralityof microphones in communication with the audio bus. The microphonemodule further comprises a module processor in communication with theplurality of microphones and the audio bus, the module processorconfigured to detect the presence of the array processor connected tothe audio bus, detect the presence of a second microphone module incommunication with the audio bus, and configure the audio bus to passaudio from both the plurality of microphones and the second microphonemodule to the array processor.

In yet another embodiment, a modular array microphone system comprisesan array processor, an audio bus, and N microphone modules, where N isat least 2. Each of the N microphone modules comprises a housing, aplurality of microphones supported by the housing, and a moduleprocessor in communication with the plurality of microphones and theaudio bus. The audio bus connects the array processor and the Nmicrophone modules such that the plurality of microphones in each of theN microphone modules is in communication with the array processor. Oneor more of the array processor and the module processors in the Nmicrophone modules is configured to detect a quantity and a connectionorder of the N microphone modules, and configure the audio bus to routeaudio signals from the plurality of microphones in each of the Nmicrophone modules to the array processor.

In yet another embodiment, a microphone module comprises a housing,having a length, a first end and a second end, an audio bus, and aplurality of microphones arranged along the length of the housing, eachof the plurality of microphones positioned generally in a directiontransverse to the length, each of the plurality of microphones incommunication with the audio bus. The microphone module furthercomprises a module processor in communication with the plurality ofmicrophones and the audio bus, the module processor configured to detectthe presence of an array processor in communication with the audio bus,detect the presence of a second microphone module in communication withthe audio bus, and configure the audio bus to pass audio from both theplurality of microphones and the second microphone module to the arrayprocessor.

In yet another embodiment, a microphone module comprises a housing, anaudio bus, and a plurality of microphones supported by the housing, eachof the plurality of microphones in communication with the audio bus. Themicrophone module further comprises a module processor in communicationwith the plurality of microphones and the audio bus, the moduleprocessor configured to detect the presence of an array processor incommunication with the audio bus and configure the audio bus to passaudio signals from the plurality of microphones to the array processor,wherein the array processor creates at least one output audio streamformed from a subset of audio signals detected by the plurality ofmicrophones, the subset based upon a position of the module in a chainof modules.

In yet another embodiment, a modular array microphone system comprises afirst microphone module and a second microphone module. Each of thefirst and second microphone modules comprises a housing, having a firstend, a middle portion, a second end, and a length extending from thefirst end to the second end, an audio bus, and a plurality ofmicrophones supported by the housing and generally dispersed across thelength of the housing, each of the plurality of microphones incommunication with the audio bus, wherein the plurality of microphonesincludes a first cluster of microphones proximate the first end, asecond cluster of microphones proximate the second end and a thirdcluster of microphone proximate the middle portion.

In yet another embodiment, a modular array microphone system comprises afirst microphone module connected to a second microphone module. Each ofthe first and second modules comprises a housing, having a first end, amiddle portion, a second end, and a length extending from the first endto the second end, an audio bus, and a plurality of microphonessupported by the housing and generally dispersed across the length ofthe housing, each of the plurality of microphones in communication withthe audio bus. The plurality of microphones includes a first cluster ofmicrophones proximate the first end, a second cluster of microphonesproximate the second end and a third cluster of microphone proximate themiddle portion. The second end of the first microphone module isconnected to the first end of the second microphone module at aconnection point to form a composite array microphone, the compositearray microphone comprising a first composite cluster, a secondcomposite cluster and a third composite cluster.

These and other embodiments, and various permutations and aspects, willbecome apparent and be more fully understood from the following detaileddescription and accompanying drawings, which set forth illustrativeembodiments that are indicative of the various ways in which theprinciples of the invention may be employed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view of a microphone module according to anembodiment of the present invention;

FIG. 1B is top view of the microphone module of FIG. 1A;

FIG. 1C is a front view of the microphone module of FIG. 1A;

FIG. 1D is an end view of the microphone module of FIG. 1A;

FIG. 2 is a block diagram of the microphone module of FIG. 1A;

FIG. 3A is a schematic view of a single microphone module of the presentinvention depicting the spacing of the microphones within the module;

FIG. 3B is a schematic view of two connected microphone modules of thepresent invention depicting the spacing of the microphones within themodules;

FIG. 3C is a schematic view of three connected microphone modules of thepresent invention depicting the spacing of the microphones within themodules;

FIG. 4 is a block diagram of a system of the present invention includinga control module and three microphone modules;

FIG. 5 is a top view of the system of FIG. 4 , depicting a systemincluding a control module and three microphone modules;

FIG. 6 is a top view of an alternative embodiment of the system of FIG.5 ;

FIG. 7 is a front view of an example implementation of a system ofmicrophone modules according to an embodiment of the present invention;

FIG. 8A is a top view of a system of microphone modules according to anembodiment of the present invention in which the system formsdirectional beams for picking up audio within an environment;

FIG. 8B is a top view of an alternative embodiment of the system of FIG.8A, having an alternative beam formation geometry;

FIG. 8C is a top view of yet another alternative embodiment of thesystem of FIG. 8A, having another alternative beam formation geometry;and

FIG. 9 is a top view of a system of microphone modules according to anembodiment of the present invention deployed in a conference roomenvironment and surface mounted on the top surface of a conferencetable.

DETAILED DESCRIPTION

The description that follows describes, illustrates and exemplifies oneor more particular embodiments of the invention in accordance with itsprinciples. This description is not provided to limit the invention tothe embodiments described herein, but rather to explain and teach theprinciples of the invention in such a way to enable one of ordinaryskill in the art to understand these principles and, with thatunderstanding, be able to apply them to practice not only theembodiments described herein, but also other embodiments that may cometo mind in accordance with these principles. The scope of the inventionis intended to cover all such embodiments that may fall within the scopeof the appended claims, either literally or under the doctrine ofequivalents.

It should be noted that in the description and drawings, like orsubstantially similar elements may be labeled with the same referencenumerals. However, sometimes these elements may be labeled withdiffering numbers, such as, for example, in cases where such labelingfacilitates a more clear description. Additionally, the drawings setforth herein are not necessarily drawn to scale, and in some instancesproportions may have been exaggerated to more clearly depict certainfeatures. Such labeling and drawing practices do not necessarilyimplicate an underlying substantive purpose. As stated above, thespecification is intended to be taken as a whole and interpreted inaccordance with the principles of the invention as taught herein andunderstood to one of ordinary skill in the art.

With respect to the exemplary systems, components and architecturedescribed and illustrated herein, it should also be understood that theembodiments may be embodied by, or employed in, numerous configurationsand components, including one or more systems, hardware, software, orfirmware configurations or components, or any combination thereof, asunderstood by one of ordinary skill in the art. Accordingly, while thedrawings illustrate exemplary systems including components for one ormore of the embodiments contemplated herein, it should be understoodthat with respect to each embodiment, one or more components may not bepresent or necessary in the system.

Turning to FIG. 1 , an exemplary embodiment of a microphone module 100for detecting sound from an external acoustic source according to thepresent invention is depicted, which may be any frequency of soundpressure, including, for example, an audio source. The microphone module100 generally comprises an elongated housing 110 having a first end 112and a second end 114. The microphone module 100 generally has a length(L) extending from the first end 112 to the second end 114. A pluralityof microphones 120 arranged in an array 122 are supported by the housing110 of the module 100. In an embodiment, the microphones 120 are mountedinside of and supported by the housing 110, but in alternativeembodiments, the microphones 120 may be mounted on the exterior of thehousing 110, partially within and partially outside of the housing 110,or in other manners such that the microphones 120 are structurallysupported by the housing 110.

In the embodiment shown in FIGS. 1A-1C, a quantity of twenty-five (25)microphones 120 are arranged in an array 122 and mounted within thehousing 110. To permit the microphones 120 of the module 100 to receivesound, one or more apertures 116 are formed into the housing 110 toallow sound to pass through the housing 110. In the embodiment depictedin FIG. 1A, a single slot-shaped aperture 116 is formed into the housing110 of the module 100, and is optionally covered in a porous screen, asshown, to protect the microphones 120 and other internal components ofthe module 100. In other embodiments, greater numbers of apertures 116may be formed in the housing 110 to permit sound from external soundsources to reach the microphones 120 supported by the housing 110 of themodule 100. The apertures 116 may take on various forms, includingslots, slits, perforations, holes, and other arrangements of openings inthe housing 110.

In the embodiment of FIG. 1 , the microphones 120 are generally arrangedin a linear fashion, forming a linear array 122 positioned along thelength (L) of the microphone module 100. While the microphones 120 aregenerally positioned along the length (L) of the module 100, they neednot be positioned along a straight line, and can be positioned invarious configurations throughout the housing 110 of the module 100. Inan embodiment, the microphones 120 are generally positioned transverseto the length (L), and may be positioned proximate the aperture 116 inthe housing 110 to detect sounds from external sources outside of themodule 100. The microphones 120 need not be parallel to one another, butin an embodiment, are preferably positioned transverse to the length (L)of the housing 110.

The microphones 120 may be directional microphones, which are positionedin a certain orientation with respect to the aperture 116 to detect anaudio source outside of the housing 110. Alternatively, the microphones120 may be non-directional, or omni-directional microphones, which neednot be positioned in a particular manner relative to the aperture 116 orhousing 110, so long as acoustic waves can penetrate the housing 110 viathe aperture 116 and reach the microphones 120. In other embodiments,other arrays 122 comprising alternative geometric arrangements ofmicrophones 120 may be utilized. For example, the array 122 may comprisemicrophones 120 arranged in circular or rectangular configurations, orhaving nested concentric rings of microphones 120 across a plane. Thelength of the housing 110 need not be the largest dimension of themodule 100, but rather can be any dimension of the module 100 alongwhich the microphones 120 are positioned. Thus, in alternativeembodiments, the layout and arrangement of the microphones 120 may beany variety of patterns, including two-dimensional and three-dimensionalarrangements of microphones 120 within the housing 110. Thesearrangements can include arced, circular, square, rectangular,cross-shaped, intersecting, parallel or other shaped arrangements ofmicrophones 120.

The microphone module 100 includes a module processor 140 and an audiobus 150, both of which are positioned within the housing 110 of themicrophone module 100 in the embodiment depicted in FIG. 1A. The audiobus 150 serves to receive audio signals from the plurality ofmicrophones 120 and to carry or transmit such audio signals along thebus 150 to other connected devices. In this way, the audio bus 150 is incommunication with the plurality of microphones 120. The audio bus 150may comprise a plurality of bus channels 152 (see FIG. 2 ) which carrythe audio signals of the audio bus 150 as described herein. The moduleprocessor 140 is a local on-board processor which is in communicationwith the plurality of microphones 120 and the audio bus 150. The moduleprocessor 140 performs a variety of functions in enabling communicationsamong the various components of the microphone module 100, as describedherein.

The microphone module 100 may further include one or more connectors130, supported by the housing 110 of the module 100. In the embodimentshown in FIG. 1 , the microphone module 100 includes a first connector132 proximate the first end 112 of the housing 110 and a secondconnector 134 proximate the second end 114 of the housing 110. Theconnectors 132, 134 are in electrical communication with the audio bus150 such that when external devices are connected to the connectors 132,134, audio signals carried by the audio bus 150 may be transmitted toand received from such external devices (not shown).

In various embodiments, the connectors 130 may be both mechanical andelectrical connection devices, as described herein. For example, theconnectors 130 may both mechanically connect one module 100 to anothermodule 200 (for example, as described with reference to FIG. 5 ). At thesame time, the connectors 130 complete electrical connections betweenconnected modules 100,200, as described in greater detail herein. Theconnectors 130 may take on a variety of different electrical interfaces,including for example, digital parallel/serial interfaces, analogparallel/serial interfaces, and other wired interfaces. Moreover, theconnectors 130 may be wireless interfaces or connection points wherebyelectrical signals are transmitted to and received from connectedexternal devices wirelessly. In such case, the wireless connectors 130may be contained completely within the housing 110 of the microphonemodule 100 rather than being visible on the exterior of the housing 110as depicted in FIG. 1 .

The connectors 130 permit the microphone module 100 to be connected toone or more other microphone modules in serial or “daisy-chained”fashion, with one module's end being connected to the next module, asexplained herein. This connectivity supports the ability of the audiobus 150 to carry audio from both the microphones 120 on board of themicrophone module 100 as well as audio from any other microphone modulesdownstream of the module 100 and connected to the module 100 via theconnectors 130. Similarly, the connectors 130 allow the audio bus 150 totransmit audio signals upstream to any other devices (such as anothermicrophone module) connected via the connectors.

In an embodiment, the module processor 140 is a field-programmable gatearray, or FPGA device. However, in other embodiments, the moduleprocessor 140 may take on various other forms of processors capable ofcontrolling inputs and outputs to the module 100 and controlling theaudio bus 150. For example, the module processor 140 could be one ofmany appropriate microprocessors (MPU) and/or microcontrollers (MCU).The module processor 140 could further comprise an application specificintegrated circuit (ASIC) or a customized hardware ASIC such as acomplex programmable logic device (CPLD). The module processor 140 couldfurther comprise a series of digital/analog bus multiplexers/switches tore-configure how inputs and outputs to the module 100 are connected.

The microphones 120 in the module 100 may be any suitable type oftransducer that can detect the sound from an audio source and convertthe sound to an electrical audio signal. In a preferred embodiment, themicrophones 120 are micro-electrical mechanical system (MEMS)microphones. In other embodiments, the microphones 120 may be condensermicrophones, balanced armature microphones, electret microphones,dynamic microphones, and/or other types of microphones.

In certain embodiments, the microphone module 100 may be able to achievebetter performance across the voice frequency range through the use ofMEMS microphones. MEMS microphones can be very low cost and very smallsized, which allows a large number of microphones 120 to be placed inclose proximity in a single microphone array. Thus, given the very smallsizes of available MEMS microphones, larger numbers of microphones 120can be included in the module 100, and such greater microphone densityprovides improved rejection of vibrational noise, as compared toexisting arrays. Moreover, the microphone density of the array canpermit varying beam width control, whereas existing arrays are limitedto a fixed beam width. In yet other embodiments, the microphone module100 can be implemented using alternate transduction schemes (e.g.,condenser, balanced armature, etc.), provided the microphone density ismaintained.

Further, by using MEMS microphones 120 in the array in the module 100,processing of audio signals may be conducted more easily andefficiently. Specifically, because some MEMS microphones produce audiosignals in a digital format, the module processor 140 need not includeanalog-to-digital conversion/modulation technologies, which reduces theamount of processing required to mix the audio signals captured by themicrophones 120. In addition, the microphone array may be inherentlymore capable of rejecting vibrational noise due to the fact that MEMSmicrophones are good pressure transducers but poor mechanicaltransducers, and have good radio frequency immunity compared to othermicrophone technologies.

In an embodiment, the microphones 120 can be coupled to, or included on,a substrate 154 mounted within the housing 110 of the module 100. In thecase of MEMS microphones, the substrate 154 may be one or more printedcircuit boards (also referred to herein as “microphone PCB”). Forexample, in FIG. 1 , the microphones 120 are surface mounted to themicrophone PCB 154 and included in a single plane. In other embodiments,for example, where the microphones 120 are condenser microphones, thesubstrate 154 may be made of carbon-fiber, or other suitable material.

The other components of the module 100 may also be supported by orformed within the substrate or PCB 154. For example, the moduleprocessor 140 may be supported by the PCB, and placed in electricalcommunication with the microphones 120, the audio bus 150 and theconnectors 130 via electrical paths formed in the PCB 154. The audio bus150, and the various bus channels 152 comprising the audio bus 150 mayalso be formed partially or entirely within or upon the PCB 154.Moreover, the connectors 130 may be supported by the PCB 154, or may beintegrally formed within or upon the PCB 154.

For example, as seen in FIG. 1 , the first connector 132 at the firstend 112 of the module 100 may comprise an electrical connectorcomprising a plurality of electrical pads 133. Similarly, the secondconnector 134 at the second end 114 of the module 100 may comprise anelectrical connector comprising a plurality of electrical contacts 135.As is described in reference to FIG. 5 , when the first end 212 of asecond module 200 is inserted into and coupled with the second end 114of a first module 100, such that their connectors 232, 134 areconnected, the electrical pads (not shown) of the second module 200 comeinto electrical contact with the electrical contacts 135 of the firstmodule 100, completing the electrical connection between the two modules100,200. The electrical pads of the second module 200 may be similar tothe electrical pads 133 of the first module 100. In an embodiment,either or both of the electrical pads 133 and contacts 135 may be formedinto the PCB, such as the first connector 132 in FIG. 1 .

In an embodiment, the audio bus 150 comprises a time division multiplexbus (or TDM bus). The TDM bus has a plurality of audio channels 152,which in the embodiment shown in FIG. 2 is eight audio channels 152. Inalternative embodiments, greater or fewer audio channels 152 may beprovided on the audio bus 150, depending on the quantity of microphones120 provided in the module 100, and the applications in which the module100 is contemplated to be used.

Using time division multiplexing, as is known, allows for transmittingand receiving independent signals over a common signal path. In TDM, aplurality of audio signals, or bit streams are transferred appearingsimultaneously as sub-channels in one communication channel, but arephysically taking turns on the communication channel. Thus, by using aTDM bus as the audio bus 150, the audio bus 150 can have fewer audiochannels 152 than the number of audio inputs. For example, as shown inFIGS. 1 and 2 , the TDM audio bus 150 has eight audio channels 152,which are in communication with twenty-five (25) microphones 120, aswell as any downstream audio from any additional microphone modulesconnected via the connectors 130. In the embodiment shown in FIGS. 1 and2 , the TDM bus 150 has eight audio channels 152 each of which can carryup to twenty-one (21) microphone signals per channel, for a total of upto 168 microphones, allowing as many as six (6) microphone modules 100to be serially connected or “daisy-chained” together and connected to asingle continuous audio bus. In other embodiments, depending on thenumber of microphones 120 present on the module 100, and theconfiguration of the TDM bus 150, even more modules 100 can be seriallyconnected to one another.

A block diagram of the microphone module 100 of FIG. 1 is depicted inFIG. 2 . As described with reference to FIG. 1 , the module 100 includesa housing 110 in which the various components of the module 100 arehoused. A plurality of microphones 120 a-y in the module are incommunication with a module processor 140, and an audio bus 150. Theaudio bus 150 is in communication with a pair of connectors 130, whichallow the modules 100 to be daisy-chained together in serial, end-to-endfashion. The audio bus 150 comprises a plurality of audio channels 152over which audio signals from the microphones 120 of the module 100, aswell as audio signals received from any downstream connected modules viathe connectors 132,134 is transmitted.

Turning to FIG. 3A, a preferred arrangement of microphones 120 in alinear array 122 for use within a microphone module 100 is depicted. Thelinear array 122 comprises twenty-five (25) microphones 120 a-y, whichare spaced from one another in the geometry depicted in FIG. 3A. In thisembodiment, the microphones 120 a-y are positioned generally along thelength (L) of the array. In some embodiments, the microphones 120 a-yare spaced and positioned along the array 122 in a harmonic nestingfashion to support directional sensitivity to audio of varying frequencybands. Using harmonic nesting techniques, the microphones 120 a-y can beused to cover a specific frequency bands within a range of operatingfrequencies. Harmonic nesting is more fully described in U.S. patentapplication Ser. No. 14/701,376 filed Apr. 30, 2015, now U.S. Pat. No.9,565,493, assigned to Shure Acquisition Holdings, Inc., which is herebyincorporated in its entirety as if fully set forth herein.

In a preferred embodiment, a group of five microphones 120 a-e arepositioned in close proximity to one another near a first end 122 a ofthe array 122 to form a first cluster 124 of microphones 120. Similarly,a second group of five microphones 120 u-y are positioned in closeproximity to one another near a second end 122 b of the array 122 toform a second cluster 126 of microphones 120. In similar fashion, athird cluster 128 of microphones 120 is formed by a group of ninemicrophones 120 i-q positioned in close proximity to one another near acenter 122 c of the array 122. This arrangement of clusters 124, 126,128 near the ends 122 a,b and center 122 c of the array 122 supports theability of the microphone module 100 to be “modular”—or connectable inseries or daisy-chained fashion with other like microphone modules toform a microphone array of varying or selectable length, as explainedherein.

The clusters 124, 126, 128 support the ability of the microphone module100 to form steerable microphone beams so as to use the microphones 120of the module 100 to transmit desired directional audio and rejectundesired audio outside of the microphone beams. Specifically, dependingon the frequency range of the audio which is sought to be captured by amicrophone array 122, it is beneficial to have a cluster 128 at thecenter 122 c of the array 122. However, if the module 100 were to onlyinclude a cluster 128 at the center 122 c of the array 122, but not atthe ends 122 a,b of the array 122, difficulties would arise whenconnecting the modules 100 in serial fashion as contemplated herein.

For example, a system of two connected modules 100, 200 is depicted inFIG. 3B. The module 200 may be similar to the module 100, and include afirst end 212, a second end 214, and a plurality of microphones 220 a-y.When the two modules 100,200 are connected or daisy-chained in seriallinear fashion as shown in FIG. 3B, a composite linear array 122,222 isformed by the arrays 122,222 of the pair of connected modules 100,200.Since each array 122, 222, includes clusters 124,126,224,226 located onthe physical ends of the arrays 122,222, when the arrays 122,222 arecombined (through the unification of the two modules 100,200), theunified array 122,222 maintains a collection of clusters 124,226 at theends of the system. Moreover, a combined cluster 126,224 remains in themiddle of the combined arrays 122,222, thereby maintaining a cluster ofmicrophones 120 in the center of the combined array 122,222. Therefore,the inclusion of clusters 124,126 at the ends of the module 100 as wellas a cluster 128 in the middle of the module 100 supports daisy chainingthe modules 100,200 together while maintaining a high level ofperformance.

The location of the clusters is further demonstrated in a system havingthree modules, as seen in the system depicted in FIG. 3C. In FIG. 3C, acomposite array 122,222,322 is formed by serial connection of threemicrophone modules 100,200,300. The module 300 may be similar to themodules 100,200, and include a housing 310, a first end 312, a secondend 314, and a plurality of microphones 320 a-y. In such aconfiguration, the cluster 228 of microphones 220 in the center 222 c ofthe array 222 of the second module 200 would also lie in the overallcenter of the composite array 122,222,322 formed by the three modules100,200,300. This would be the case for any system having an odd numberof modules formed in linear fashion. The module 300 may include otherclusters 324, 326, 328. The module 300 may also include a firstconnector 332 and a second connector 334.

Since the microphone module 100 is designed to be used in systems ofvarying numbers of modules, it is important that the module 100 beconfigured to support connectivity of any number of modules as describedabove—that is, having a cluster 128 of microphones 120 in the center 122c of the array 122 (as well as end clusters on the array 122) regardlessof whether odd or even numbers of modules 100 are serially connected ordaisy chained in linear fashion. In an embodiment, this is accomplishedby the inclusion of the first and second clusters 124,126 at the firstand second ends 122 a,122 b of the array 122. These end clusters 124,126come together to form a cluster at the center of a composite arrayformed from even numbered quantities of modules 100.

For example, returning to FIG. 3B, two microphone modules 100,200 areconnected together in serial fashion to form a composite linear array122,222. By positioning the first and second modules 100,200 in physicalproximity to one another, the second end 114 of the housing 110 of thefirst module 100 is proximate the first end 212 of the housing 210 ofthe second module 200. In this way, the housings 110,210 effectivelyform a single system of microphones 120,220, formed by the sets ofmicrophones 120,220 of the individual modules 100,200 forming thesystem. This further results in the second end 122 b of the array 122 ofthe first module 100 being adjacent to the first end 222 a of the array222 of the second module 200, effectively forming a single, linearcomposite array 122,222 comprising the two arrays 122,222 of the twomodules 100,200. The inclusion of the end clusters 124,126,224,226 onthe arrays 122,222 of the modules 100,200 ensures that a cluster ofmicrophones 120,220 is formed when two modules 100,200 are connected inthis fashion. Specifically, as seen in FIG. 3B, the second cluster 126of microphones 120 on the first module 100 is proximate the firstcluster 224 of microphones 220 of the second module 200, such that thecomposite array 122,222 now includes a center cluster of microphones120,220 formed by these two clusters 126,224. Similarly, in any systemincluding an even number of modules 100 connected together in serial,linear fashion, the system will always include a cluster of microphones120 in the center of the composite array 122,222 formed by the modules100,200 in the system.

Turning to FIG. 4 , a block diagram of an embodiment of a modular arraymicrophone system 50 is depicted. The system 50 includes one or moremicrophone modules 100, such as the modules 100,200,300 described inreference to FIGS. 1 and 2 . In the embodiment shown, the system 50includes three microphone modules 100,200,300. The system 50 furtherincludes an array processor 60 which is in communication with themodules 100,200,300 of the system 50. The array processor 60 acts tocontrol the system 50, and works in conjunction with the moduleprocessors 140, 240, 340 of the connected modules 100,200,300.

In an embodiment, such as the one shown in FIG. 4 , the system includesa control module 62, which may be a separate piece of hardware from themicrophone modules 100,200,300 in the system 50. The control module 62comprises a housing 64 which contains the components of the controlmodule 62. The array processor 60 may be a component of the controlmodule 62 and located within the control module housing 64. The controlmodule 62 may include a connector 66 for placing the control module 62in electrical connection with the other components of the system 50,such as the microphone modules 100,200,300, for example through the useof an appropriate cable connection.

In alternative embodiments, such as the embodiment shown and describedwith reference to FIG. 6 , the array processor 60 may be on board of oneor more of the microphone modules 100,200,300, such that a separatecontrol module 62 is unnecessary. In such embodiments, each microphonemodule 100,200,300 may include an array processor 60, such that when themodules 100,200,300 are interconnected as described herein, the on boardarray processors 60 will be in communication with one another via theaudio bus 150, or other electrical connections between the modules100,200,300. Once interconnected, one or more of the array processors 60of the system 50 may perform the system control and processing functionsas described herein with reference to the array processor 60.

In an embodiment, a plurality of modules 100,200,300 may be connected inserial fashion via their respective connectors 130,230,330, and in turn,connected to the array processor 60, via the connector 66 on the controlmodule 62, as seen in FIGS. 4-6 . More specifically, an electricalconnection is made from the connector 66 of the control module 62 to thefirst connector 132 of the first microphone module 100. To “daisy chain”or serially connect the second microphone module 200, an electricalconnection is made from the second connector 134 of the first module 100to the first connector 232 of the second module 200. Similarly, a thirdmicrophone module 300 can be added to the chain by completing anelectrical connection from the second connector 234 of the secondmicrophone module 200 to the first connector 332 of the third module300. The system 50 can be increased to include additional microphonemodules 100,200,300 connected in similar manner using the availableconnections 130,230,330 on the modules 100,200,300.

Once connected, the array processor 60 controls the system 50 byinteracting with the audio bus 150,250,350 passing through the connectedmicrophone modules 100,200,300. The audio buses 250, 350 may be similarto audio bus 150 and may comprise a plurality of bus channels 252, 352,respectively, which carry the audio signals of the audio buses 250, 350.In this way, the array processor 60 acts as a master controller of thesystem 50. The module processors 140, 240,340 support the system 50 byrelaying information to and from the array processor 60, and assistingin configuring the system 50 operationally. Once connected, the audiobusses 150, 250,350 of the various modules 100,200,300 work in concertto form a composite audio bus for the system 50.

For example, in an embodiment such as the one shown in FIG. 4 , once thesystem 50 components are connected and powered up, the module processors140,240,340 work in conjunction with the array processor 60 to determineand identify the connected components in the system 50. In anembodiment, the system 50 self detects, realizes, and shares informationabout the connected components of the system—including the quantity andconnection order of the microphone modules 100,200,300 in the system 50.Thus, each module processor 140,240,340 can determine what is connectedto the module 100,200,300 on which it resides, and the interconnectedmodules 100,200,300 can share that connection information with oneanother, and with the array processor 60.

In an embodiment, depicted in FIG. 4 , for example, the moduleprocessors 140,240,340 can determine the connection configuration of themicrophone module 100,200,300 on which the processor 140,240,340resides. In the embodiment shown, each microphone module 100,200,300will be detected as being one of five available connectionconfigurations. For example, if the first microphone module 100 was notconnected to either a control module 62 or array processor 60, nor wasit connected to any other microphone modules 200,300, its moduleprocessor 140 could detect that the microphone module 100 was in a“Stand Alone” configuration—and the module 100 could be placed inoperation in such a configuration. If the microphone module 100 wasconnected to a control module 62, but not to any other microphonemodules 200,300, the module processor 140 could detect that it was in a“Single Block with Array Processor” configuration, comprising a system50 of just an array processor 60 and one connected module 100.

If the microphone module 100 was connected to a control module 62, andat least one other microphone module 200,300, the module processor 140could detect that it was in a “First Block” configuration (signifyingthat the module 100 was the first in chain of a plurality of modules100,200,300 connected to the control module 62). If a microphone module200 was neither the first nor the last module 100,300 in a chain ofmodules 100,200,300 connected to a control module 62, the moduleprocessor 240 would detect that the microphone module 200 was in a“Middle Block” configuration. Finally, if a microphone module 300 wasthe last module 300 in a chain of modules 100,200,300 connected to acontrol module 62, the module processor 340 would detect that themicrophone module 300 was in a “Last Block” configuration. Thus, theself-detection capabilities of the system 50 allow each module100,200,300 in the system to determine which of the five configurationsit is in (Stand Alone, Single Block with Array Processor, First Block,Middle Block, or Last Block), and to share such configurationinformation with the other modules 100,200,300 of the system 50, as wellas the array processor 60, to configure the system 50.

Through interactions between one or more of the array processor 60 andthe microphone module processors 140,240,340, the system 50 isintelligent so as to sense and determine its configuration. For example,in the three module system depicted in FIG. 4 , after the self detectionprocesses executes and completes as described above, the array processor60 and each of the module processors 140,240,340 will know the quantityof connected microphone modules 100,200,300 (in this case three), and aconnection order of the connected microphone modules 100,200,300 (inthis case, the first module 100 is connected first, the second module200 is connected second, and the third module 300 is connected third).One or more of the processors 60,140,240,340 will configure the modules100,200,300 so that the system 50 places the first module 100 in “FirstBlock” mode or configuration, places the second module 200 in a “MiddleBlock” mode, and places the third module 300 in a “Last Block” mode.

These configuration steps set up the system 50 to work in a unifiedmanner, and allow the module processors 140,240,340 to configure eachmodule 100,200,300 to properly populate the audio bus 150,250,350 withaudio signals from both the on board microphones 120,220,320 of themodules 100,200,300 as well as any audio from downstream modules200,300. For example, the third module 300, being in “Last Block” mode,knows that it is not going to receive any audio signals from anydownstream modules, since no additional modules are connected to it.Therefore, the system 50 configures the audio bus 350 so as to populatethe audio bus 350 with audio signals from its onboard microphones 320.The second module 200, being in “Middle Block” mode, knows that it isreceiving audio signals from one or more downstream modules (in thiscase the third module 300). Therefore, the system 50 configures theaudio bus 250 so as to populate the audio bus 250 with audio signalsfrom both its onboard microphones 220 as well as audio signals fromconnected downstream modules, such as the third module 300. Similarly,the first module 100, being in “First Block” mode, knows that it isreceiving audio signals from one or more downstream modules (in thiscase the second and third modules 200,300). Therefore, the system 50configures the audio bus 150 so as to populate the audio bus 150 withaudio signals from both the onboard microphones 120 as well as audiosignals from connected downstream modules, such as the second and thirdmodules 200,300.

In this way, the system 50, across the control module 62 and connectedmicrophone modules 100,200,300, comprises a composite audio bus formedfrom the audio busses 150,250,350 of the connected microphone modules100,200,300. The composite audio bus carries all of the audio signalsfrom the microphones 120,220,320 of the connected microphone modules100,200,300, and passes those audio signals to the control module 62where they can be processed and further transmitted by the arrayprocessor 60. Thus, in embodiments, the array processor 60 is also incommunication with an output channel to transmit audio received by thearray processor 60 via the composite audio bus 150,250,350. For example,the array processor 60 may be in communication with an output channelvia a connection in the control module 62 that allows outbound audio tobe further transmitted to an output device. For example, the outputdevice may be one or more speakers for transmitting the sound, an audioamplifier, a telecommunications device for transmitting sound, etc. In aconferencing environment, the output channel may connect to localloudspeakers mounted in the environment for sound reinforcement. Or theoutput channel may connect to a teleconferencing bridge for transmittingaudio to remote locations, for example, other users connected to aconference call.

As described herein, the modular aspect of the microphone modules 100allow creation and configuration of various systems 50 using the modules100 as “building blocks” for the system 50. In this way, the system 50uses the modules 100 to form an “array of array microphones” by usingthe modular nature of each of the microphone modules 100,200,300 to forma customized microphone array, which depends on the number of themicrophone modules 100,200,300 which are connected together to form thesystem 50. The array processor 60 can then use audio signals from anyand all of the microphones 120,220,320 in the system to perform flexiblebeam forming calculations, and form steerable microphone beams asdescribed further herein.

Turning to FIG. 5 , an example embodiment of the system 50 of FIG. 4 isdepicted. As described, the three microphone modules 100,200,300 areconnected and daisy chained together to form a single microphone array.The first module 100 is connected to the control module 62 via anelectrical cable which connects the control module connector 66 to thefirst connector 132 of the first module 100. It should be understoodthat the electrical cable connecting the control module connector 66 andthe first connector 132 need not directly connect the two connectors66,132—but rather, one or more intermediate pieces of hardware,processing units, or cabling may exist in such connection, so long assignals can pass to and from the array processor 60 and the first module100 such that the two are in communication.

The second connector 134 of the first module 100 is connected to thefirst connector 232 of the second module. Similarly, the secondconnector 234 of the second module 200 is connected to the firstconnector 332 of the third module 300. Thus, in the embodiment shown inFIG. 5 , the modules 100,200,300 are connected mechanically andelectrically to form a single array comprised of the threeinterconnected modules 100,200,300.

In an alternative embodiment depicted in FIG. 6 , the various modules100,200,300 of the system 50 may be electrically connected by variouswires or cables 131. Thus, a first cable may be used to connect thesecond connector 134 of the first module 100 to the first connector 232of the second module 200. Similarly, a second cable may be used toconnect the second connector 234 of the second module 200 to the firstconnector 332 of the third module 300. The use of connecting cables, asshown, provides greater flexibility in mounting the modules 100,200,300since in this embodiment, the modules 100,200,300 are not mechanicallyconnected to one another, but rather are only electrically connected viathe cables between their respective connectors 130,230,330. Thus, byusing connecting cables of various lengths, the physical spacing of themodules 100,200,300 of the system 50 can be customized and controlled inthe environment in which the system 50 is deployed. In these ways, theability to connect or daisy chain the modules 100,200,300 allowsdesigners and installers of such systems 50 to create custom lengthmicrophone arrays by employing different numbers of microphone modules100,200,300 connecting them in the ways described herein.

Additionally, in the embodiment shown in FIG. 6 , the array processor(s)60 which control the system 50 may be included on board of the variousmodules 100,200,300 of the system 50 (as opposed to in a separatehardware control module 62 like other embodiments described herein).Thus, in FIG. 6 , each of the microphone modules 100,200,300 includes anarray processor 60 a,60 b,60 c. Turning to the first module 100, thearray processor 60 a is in communication with the other components ofthe module 100, including the module processor 140, the audio bus 150,the connectors, 130,132,134, and the microphones 120. The other modules200,300 are similarly configured. Thus, the various array processor 60a,60 b,60 c may work together to perform system level control andprocessing in a manner similar to the array processor 60 in FIG. 5 . Inthe embodiment in FIG. 6 , the system 50 may configure itself such thatone of the array processors 60 a,60 b,60 c is a “master” arrayprocessor, and controls the system level processing of the system 50.Alternatively, a plurality, or all of the array processors 60 a,60 b,60c may handle the system level processing demands, as described herein.

In an embodiment of the invention, the system 50 must compensate fortime shifts in the various audio signals received by the array processor50 via the composite audio bus 150,250,350. Thus, because the variousmicrophones 120,220,320 of the various connected microphone modules100,200,300 of a system 50 are receiving audio at the same time, buttransmitting such audio to the array processor 60 over differing lengthsof the audio bus 150,250,350, the audio signals received by themicrophones 120,220,320 may arrive at the array processor 60 withvarying latencies and delays. Thus, the system 50 needs to account forthe varying latencies of the received audio signals from the microphones120,220,320 of the modules 100,200,300 in the system 50. In anembodiment, the array processor 60 performs a time alignment process tosynchronize the audio received from the various microphones 120,220,320of the modules 100,200,300. This prevents undesirable effects such asecho or noise as the array processor 60 further transmits the audiosignals of the system 50 to output devices. The time alignment process,or synchronization, can be performed by the array processor 60, on asystem level. Alternatively, the time alignment process can be performedby one or more of the module processors 140,240,340 of the modules100,200,300 of the system. Or the processors 60,140,240,340 may timealign the audio signals by working cooperatively. In an embodiment, thesystem 50 may encode the audio signals with time stamp information whenthe audio signals are transmitted via the audio bus 150,250,350, and usesuch time stamp information to time align the audio signals.

Turning to FIG. 7 , an alternative embodiment of a system 50 including aplurality of microphone modules 100 is depicted. In this embodiment, oneor more modules 100 are connected in banks 70 a,b,c,d, with each bank 70a,b,c,d being connected to a central control module 62, specifically viathe connector 66 of the module 62. It should be understood that theconnector 66 may be a single electrical connector or connection point,or alternatively may comprise a plurality of connectors or connectionpoints used to connect the various banks 70 a,b,c,d as described herein.

As seen in FIG. 7 , in a particular application in a conferencingenvironment, four banks 70 a,b,c,d of microphone modules100,200,300,400,500,600 are connected around the periphery of a wallmounted television 80. The first bank 70 a is mounted above thetelevision 80, and comprises six modules 100 a,200 a,300 a,400 a,500a,600 a, connected in a daisy chained fashion as described herein. Thefirst module 100 a is connected to the control module 62 as describedwith reference to FIGS. 4-6 . Similarly, a second bank 70 b of modulesis positioned along a right edge of the television 80. The second bank70 b comprises two modules 100 b,200 b connected in a daisy chainedfashion with the first module 100 b connected to the control module 62.A third bank 70 c of modules is mounted along a bottom edge of thetelevision 80. The third bank 70 c comprises six modules 100 c,200 c,300c,400 c,500 c,600 c, with the first module 100 c connected to thecontrol module 62. Finally, a fourth bank 70 d of modules is positionedalong a left edge of the television 80. The fourth bank 70 d comprisestwo microphone modules 100 d,200 d connected in a daisy chained fashionwith the first module 100 d connected to the control module 62.

Therefore, the system 50 depicted in FIG. 7 comprises a plurality ofbanks 70 a,b,c,d connected to a central control module 62 having anarray processor 60. Each of the banks 70 a,b,c,d comprises a pluralityof modules 100,200,300,400,500,600. All of the modules 100 of thevarious banks 70 a,b,c,d are under the control of the central controlmodule 62 as described herein. Therefore, the flexibility of the system50 is a valuable asset to designers and installers of such systems 50 inthat the length of the various banks 70 a,b,c,d can be customized withdiffering numbers of modules 100 in each bank 70 a,b,c,d, and any ofnumber of banks 70 a,b,c,d can be utilized to create systems 50 havingappropriate placement of microphone arrays in a variety of environmentswhere sound is to be captured and transmitted by the system 50. Thevarious arrangements of modules 100 in banks 70 a,b,c,d as depicted inFIG. 7 allows for highly customizable solutions to be provided in thefield with quantities of a single variety of array module 100, makingsuch systems 50 desirable for ease of installation and design. Thus, thesystem 50 can be configured to comprise one chain of serially connectedmodules 100,200,300—such as the system depicted in FIGS. 4-6 . Or thesystem 50 can be configured to comprise multiple chains of seriallyconnected modules, arranged in banks 70 a,b,c,d, such as the system 50depicted in FIG. 7 .

Systems 50 such as the one depicted in FIGS. 1-7 and described inrelation to the other figures, may be configured, controlled andutilized to form microphone pick up patterns or “beams” to optimizedirectional sensitivity of the system 50, as described herein. Forexample, turning to FIGS. 8A-8C, a variety of steerable beams 90 a-g maybe formed using the microphones of the various modules 100,200,300 ofthe system 50. In FIG. 8A, such a system 50 includes three microphonemodules 100,200,300 connected in a daisy chained fashion as describedherein. Under the control of a connected control module (not shown), themicrophone modules 100,200,300 may be used to form a variety of beams 90a-g having various shapes, sizes, and directional pick up patterns. Forexample, as seen in FIG. 8A, a first beam 90 a may be formed by thesystem 50 using only the first module 100, and extending in an ovalshaped fashion in a direction transverse to the module 100.Simultaneously, a second beam 90 b may be formed using the second andthird modules 200,300, and extending in a wider oval shaped manner, alsotransverse to the length of the modules 200,300. In this way, thecontrol module 62 can operate the modules 100,200,300 of the system 50independently or in concert to form a variety of beams 90 a,b. The beamscan be entirely within a single module 100, such as beam 90 a. Oralternatively the beams can be across multiple modules 200,300, such asbeam 90 b.

Turning to FIG. 8B, another embodiment of the system 50 of FIG. 8A isdepicted, in which a plurality of beams 90 c,d are formed across aplurality of modules 100,200,300. In this embodiment, a first beam 90 cis formed across a first module 100 and a portion of a second module200. A second beam 90 d is formed across a portion of the second module200 and a third module 300. Thus, the control module 62 uses threemicrophone modules 100,200,300 to create a pair of symmetrical beams 90c,d which are oval shaped pick up patterns extending from and transverseto the modules 100,200,300.

In yet another embodiment depicted in FIG. 8C, the system 50 of FIG. 8Ais configured to create overlapping beams 90 f,g. In this embodiment, afirst beam 90 f is formed across a portion of a first module 100 and aportion of a second module 200. A second beam 90 g is formed across aportion of the second module 200 and a portion of a third module 300.Both beams 90 f,g are oval shaped pick up patterns extending from andtransverse to the modules 100,200,300. However, in this embodiment, thebeams 90 f,g overlap to achieve the desired pick up pattern depicted inFIG. 8C.

Therefore, the control module 62 can use the microphones 120 of thefirst module 100, the microphones 220 of the second module 200 and themicrophones 320 of the third module 300 to create independent beams 90a-g which can be created entirely on one module 100,200,300, extendacross multiple modules 100,200,300 and can be distinct and separatefrom one another (such as the beams 90 a-d in FIGS. 8A-8B) or canoverlap (such as the beams 90 f,g in FIG. 8C). In this way, themicrophones of the various modules 100,200,300 can be used to form beams90 a-g of a variety of shapes, sizes, and directions. Moreover, audiosignals received by a microphone 120 aboard one of the modules 100 maybe utilized to form multiple beams 90 a-g. Thus, each microphone 120,220, 320 of the system 50 can participate in forming multiple beams 90a-g such as the microphones 220 of the second module 200 depicted inFIG. 8C, which participate in forming both beams 90 f,g shown.

Turning to FIG. 9 , another application of a system 50 according to theembodiments described herein is depicted. In the depicted application,the system 50 is deployed in a conference room setting, which includes aconference table 82 and a plurality of sound sources, in this casehumans talking, or “talkers” 84 a-f, positioned around the table 82. Inthe configuration shown, six talkers 84 a-f are positioned around theconference table 82, with three talkers 84 a,b,c on one side of thetable 82 and three talkers 84 d,e,f on the opposite side of the table82. A system 50 is deployed in the environment which includes sixmicrophone modules 100,200,300,400,500,600 connected to a control module(not shown). The six modules 100,200,300,400,500,600 are connected in adaisy chained fashion to create a microphone array, which in this caseis positioned on a top surface of the conference table 82.

The control module (not shown) has configured the system 50 to create aplurality of beams 90 h,i,j,k for the purposes of picking up the soundsand audio created by the talkers 84 a-f. As depicted in FIG. 9 , threehigh frequency beams 90 h,i,j have been created by the system 50, eachof the beams 90 h,i,j being a similarly sized and shaped oval pick uppattern extending transversely from the modules 100,200,300,400,500,600.The first high frequency beam 90 h is created across the first andsecond modules 100,200, extending in opposite directions from themodules 100,200 so as to create directional pick up patterns tooptimally pick up audio from two talkers 84 a,d seated across from eachother proximate a left end of the conference table 82. The second highfrequency beam 90 i is created across the third and fourth modules300,400, extending in opposite directions from the modules 300,400 so asto create directional pick up patterns to optimally pick up audio fromtwo talkers 84 b,e seated across from each other proximate a center ofthe conference table 82. Similarly, the third high frequency beam 90 jis created across the fifth and sixth modules 500,600, extending inopposite directions from the modules 500,600 so as to create directionalpick up patters to optimally pick up audio from two talkers 84 c,fseated across from each other proximate a right end of the conferencetable 82.

The system 50 further includes a low frequency beam 90 k, which iscreated across all six of the modules 100-600, extending from the firstmodule 100 to the last module 600. Like the high frequency beams 90h,i,j, the low frequency beam 90 k extends in opposite directions fromthe modules 100-600 so as to create directional pick up patterns tooptimally pick up low frequency components of all six of the talkers 84a-f, seated on opposing sides of the conference table 82. Therefore, thesystem 50 may create different beams 90 h,i,j,k for different frequencyranges, using different subsets or portions of the modules 100-600 usedto create the system. In an embodiment, low frequency audio sources aremore effectively captured by physically longer arrays, such that it isoptimal to use the entire length of the system of modules 100-600 tocapture such low frequency sources. Conversely, it may be more effectiveto capture higher frequency audio sources by shorter arrays, such thatit is optimal to use microphones across a subset of the availablemodules 100-600 to create a beam (such as beam 90 h which is createdacross the first two modules 100,200).

In this way, the system 50 uses the microphones of the various connectedmodules 100,200,300,400,500,600 to create beams 90 h,i,j,k which areconfigured for optimal pick up of audio in the environment. In thesystem 50 of FIG. 9 , six modules 100,200,300,400,500,600 are used tocreate four beams 90 h,i,j,k to capture audio signals from six talkers84 a-f seated around a conference table. However, given the efficientconfigurability of the system 50, the control module could quickly andeasily reconfigure the system 50 to create greater or fewer beams 90h,i,j,k, or to change the shape and positioning of beams 90 h,i,j,k toaccommodate changes in the environment, without having to disconnect,move, or disturb the hardware arrangement of the modules100,200,300,400,500,600. This flexibility is one of many advantagesprovided by such a system 50 using connectible microphone modules 100.Moreover, the system 50 can move, adjust or “steer” the beams 90 h,i,j,ksuch that the axis of the beams 90 h,i,j,k is better aligned with theintended sound source so as to more optimally capture audio coming fromthe source.

As can be understood from the example embodiments described herein,various systems 50 using a plurality of modules 100,200,300, can becreated and deployed in a variety of environments. Thus, in a system 50including “N” modules 100, the array processor 60 may select from theavailable microphones 120 across the various N modules 100 in selectingaudio signals to utilize for creating and forming the steerable beams 90a-k used by the system 50. In an embodiment, the microphones 120 whichthe system 50 selects, and modules 100 upon which those microphones 120are located are based upon the number of modules 100, or “N”, of thesystem 50. Therefore, for example, a system 50 having three modules 100may utilize different microphones 120 across the modules to form anoptimal beam to pick up directional sound from a source, than in asystem 50 having six modules 100. Therefore, in an embodiment, the arrayprocessor 60 determines the number of modules 100 available to thesystem 50, or “N”, as well as the number of microphones 120, and usesthis data in beam forming as described herein. In other embodiments,other data may be collected from the system 50 and used in configurationof the number, size, and shape of the microphone beams.

The systems 50 described herein generally refer to pick up of audio fromacoustic sources within the audible spectrum (approximately 20 Hz-20KHz). However, the systems 50 described herein are not limited toacoustic signals within the audible spectrum and can be configured topick up acoustic sources of varying frequencies. Therefore, as usedherein, “audio sources” and “audio bus” should not be construed to belimited in any way with respect to the frequency of such signals—rathersuch terms are intended to include detection of all ranges of acousticsignals. Therefore, the microphones 120 of the various modules 100 andsystems 50 described herein can be any variety of transducers, includingtransducers that are capable of detecting acoustic signals outside ofthe audible frequency range—for example, ultrasound waves. In mannerssimilar to those described herein, the systems 50 and modules 100 of thepresent disclosure can be configured to detect such other acousticsignals and to process and transmit them in a similar manner to theaudio signals described herein.

In various embodiments, the modules 100 themselves, including thegeneral shape and configuration of the modules 100 and their housings110 may take on a variety of shapes. For example, the modules 100 may beelongated and linear such as some of the embodiments shown herein.Alternatively, the modules 100 may be arced, circular, square,rectangular, cross-shaped, intersecting, parallel or other arrangements.The modules 100 may include more than two connectors on them, so thatthey may be mechanically connected to one another to form systems 50 ofmodules 100 of varying shapes, sizes and configurations. For example,the modules 100 may be connected together to extend in two dimensions(such as a cross-shaped arrangement, or rectangular arrangement ofmodules), or in three dimensions (such as modules connected in a cube,sphere, or other three dimensional shape). In an embodiment, a system 50may include three dimensional configuration of modules 100interconnected to one another so as to form an object which may beplaced in an environment, for example, by suspending the system from theceiling in a “chandelier like” fashion.

In alternative embodiments, it should be understood that other audio busconfigurations may be utilized. For example, a system of modules may beused where the modules are mechanically interconnected to form an arrayof modules, without the audio being passed “upstream” through eachmodule, but rather using a different audio signal routing. In one suchembodiment, audio signals from each module in the system can be routedto a central point or hub, and then from that central point, upstream tothe array processor. Such a configuration may be referred to as a “huband spoke” configuration, or “star topology.” In other embodiments, aplurality of hubs may be used, whereby each hub collects audio signalsfrom a plurality of connected modules, and passes the combined audio upto one or more array processors. Other configurations of audio routingare possible as well.

Any process descriptions or blocks in figures should be understood asrepresenting modules, segments, or portions of code which include one ormore executable instructions for implementing specific logical functionsor steps in the process, and alternate implementations are includedwithin the scope of the embodiments of the invention in which functionsmay be executed out of order from that shown or discussed, includingsubstantially concurrently or in reverse order, depending on thefunctionality involved, as would be understood by those having ordinaryskill in the art.

This disclosure is intended to explain how to fashion and use variousembodiments in accordance with the technology rather than to limit thetrue, intended, and fair scope and spirit thereof. The foregoingdescription is not intended to be exhaustive or to be limited to theprecise forms disclosed. Modifications or variations are possible inlight of the above teachings. The embodiment(s) were chosen anddescribed to provide the best illustration of the principle of thedescribed technology and its practical application, and to enable one ofordinary skill in the art to utilize the technology in variousembodiments and with various modifications as are suited to theparticular use contemplated. All such modifications and variations arewithin the scope of the embodiments as determined by the appendedclaims, as may be amended during the pendency of this application forpatent, and all equivalents thereof, when interpreted in accordance withthe breadth to which they are fairly, legally and equitably entitled.

The invention claimed is:
 1. A modular array microphone systemcomprising a first microphone module and a second microphone module,wherein each of the first and second microphone modules comprises: ahousing, having a first end, a middle portion, a second end, and alength extending from the first end to the second end; an audio bus; anda plurality of microphones supported by the housing and generallydispersed across the length of the housing, each of the plurality ofmicrophones in communication with the audio bus, wherein the pluralityof microphones includes a first cluster of microphones proximate thefirst end, a second cluster of microphones proximate the second end, anda third cluster of microphones proximate the middle portion; wherein thefirst microphone module and the second microphone module are physicallyconnected together to form a composite array microphone comprising atleast one composite cluster.
 2. The system of claim 1, wherein each ofthe first and second microphone modules further comprises a moduleprocessor in communication with the plurality of microphones and theaudio bus, the module processor configured to detect the presence of anarray processor in communication with the audio bus and configure theaudio bus to pass audio signals from the plurality of microphones to thearray processor.
 3. The system of claim 2, wherein the array processorprocesses the audio signals from the plurality of microphones to form atleast one steerable beam.
 4. The system of claim 3, wherein the at leastone steerable beam comprises the audio signals from at least one of thefirst cluster of microphones, the second cluster of microphones, and thethird cluster of microphones.
 5. The system of claim 1, wherein the atleast one composite cluster comprises a combination of the secondcluster of microphones of the first microphone module and the firstcluster of microphones of the second microphone module.
 6. The system ofclaim 1, wherein the first cluster of microphones comprises a quantityof X microphones, the second cluster of microphones comprises a quantityof Y microphones and the third cluster of microphones comprises aquantity of Z microphones.
 7. The system of claim 6, wherein Z isgreater than X and Z is greater than Y.
 8. The system of claim 7,wherein X is equal to Y.
 9. The system of claim 6, wherein X is equal toY.
 10. A modular array microphone system comprising a first microphonemodule connected to a second microphone module, wherein each of thefirst and second microphone modules comprises: a housing, having a firstend, a middle portion, a second end, and a length extending from thefirst end to the second end; an audio bus; and a plurality ofmicrophones supported by the housing and generally dispersed across thelength of the housing, each of the plurality of microphones incommunication with the audio bus, wherein the plurality of microphonesincludes at least one cluster of microphones; wherein the second end ofthe first microphone module is physically connected to the first end ofthe second microphone module at a connection point to form a compositearray microphone, the composite array microphone comprising at least onecomposite cluster.
 11. The system of claim 10, wherein the at least onecluster of microphones comprises a first cluster of microphonesproximate the first end, a second cluster of microphones proximate thesecond end, and a third cluster of microphones proximate the middleportion.
 12. The system of claim 10, wherein each of the first andsecond microphone modules further comprises a module processor incommunication with the plurality of microphones and the audio bus, themodule processor configured to detect the presence of an array processorin communication with the audio bus and configure the audio bus to passaudio signals from the plurality of microphones to the array processor.13. The system of claim 12, wherein the array processor processes theaudio signals from the plurality of microphones to form at least onesteerable beam.
 14. The system of claim 10, wherein the at least onecomposite cluster comprises a first composite cluster, a secondcomposite cluster, and a third composite cluster.
 15. The system ofclaim 14, wherein the first composite cluster comprises a first clusterof microphones of the first microphone module.
 16. The system of claim15, wherein the second composite cluster comprises a second cluster ofmicrophones of the second microphone module.
 17. The system of claim 16,wherein the third composite cluster comprises a combination of thesecond cluster of microphones of the first microphone module and thefirst cluster of microphones of the second microphone module.
 18. Thesystem of claim 14, wherein the third composite cluster is locatedproximate the connection point of the first and second microphonemodules.
 19. A microphone module, comprising: an audio bus; and aplurality of microphones generally dispersed across a length of themicrophone module, each of the plurality of microphones in communicationwith the audio bus, wherein the plurality of microphones includes atleast one cluster of microphones; wherein the microphone module isphysically connectable to another microphone module to form a compositearray microphone, the composite array microphone comprising at least onecomposite cluster that is comprised of the at least one cluster ofmicrophones.